The group has delivered a step change in profitability with impressive earnings growth in the first half of the financial year. The Transact platform demonstrated strong performance in flows and FUD, ...

Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

Forward-looking: For years, the chip industry has chased better performance by shrinking transistors and squeezing more of them onto a flat slice of silicon. That strategy is running into hard limits.

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...